Recent #Advanced Packages news in the semiconductor industry

9 months ago
➀ Yole Group predicts a CAGR of 9% for the advanced IC substrate market between 2024 and 2029, reaching $25.53 billion in 2029; ➁ The market is seeing a shift from organic core substrates to glass core substrates, driven by demand for FC BGA substrates and 2.5D/3D advanced packages; ➂ Investment in expansion and new plants for high-end substrates is increasing, particularly in the U.S. and China, supported by local government incentives.
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